-Article By David Lui
Laser direct-write is a new processing technology that allows the rapid fabrication of micro devices and circuits. These micro devices and circuits find applications in a variety of areas such as microelectronics, photonics, MEMS, and MOEMS. This technology utilizes low temperature processing (200-350°C) and does not require the use of masks, screens, molds, or stamps. It also avoids the use of phororesists and complex chemistries with associated costs and potential environmental consequences. Laser direct-write technology is able to produce features as small as a few microns in dimension.
Today, there are two dominant processing technologies in the microelectronics industry: thick-film and thin-film. Thickfilm technology utilizes imaged screens to print materials on a substrate followed
by firing at high temperature, typically between 800-1200°C. Successive screenprinting and firing process steps are used to build the circuit. Thjck-film technology has been used to fabricate Multi-Chip Modules (MCMs) and 3-D circuitry via a Low Temperature (-850°C) Co-fired Ceramic (LTC C) process. Thick-film technology cannot easily produce lines and spaces smaller than -100 Mm (0.004″) wide.
