Potomac Photonics has extensive experience laser cutting micro features in silicon wafers. Our high-speed cutting and drilling processes deliver exceptionally sharp edges with minimal dross and burrs, ensuring superior precision and quality.
Laser cutting of silicon wafers is possible across all sizes and thicknesses, with feature sizes as small as 20 microns. Additionally, complex features such as channels and pockets can be precisely machined into silicon wafers. All that is required is a drawing to getting started.
Check out our Gallery to see a large variety of micro machined parts.
